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THPO004 | Electro- or Chemical- Polishing and UHV Baking of Superconducting rf Nb Cavities and Q(H) Dependencies | 695 |
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Standard treatments to achieve excellent high rf power Nb accelerator cavities after machining are electro polishing (EP,>0.050mm), buffered chemical polishing (BCP,~0.01mm), or subsequent ~120°C (>10h) UHV baking (LTB)[1-4]. LFQ and HFQ have been discussed in detail in [2,4], here we concentrate on oxidation and on MFQ described by ΔR(H)=R1|H/Hc| + R2(H/Hc)², where R1 is related to hysterics weak link, flux losses and R2 is mainly related to heating [3]. The observed differences between BCP, EP and LTB can be related to differences in Nb2O5/NbOx/Nb interfaces. For example: by BCP oxidation the repeated Nb2O5-crystallite nucleation creates DS, weak links and injects O into larger depth [2] where the weak links strengthen MFQ [1,3]; by EP the repeated Nb2O5-crystallite nucleation is missing and so O sticks to the surface and less DSs and weak links are created resulting in less MFQ [1]; and by LTB at, and adjacent to, Nb surfaces O precipitates enforcing MFQ and LTB, enhancing Hc3 and reducing, e.g. RBCS(T,<15GHz) [1-4]. Depending on details to be discussed these intermingled LTB effects after EP may reduce or enhance R(T,<GHz,<20MeV/m).
[1] A.Romanenko et al.,PAC’11 [2] A.S.Dhavale, Symp. Techn.of Nb.,JLAB, Sept.2010 [3] G.Ciovati et al., PhysicaC 441,57(2006) [4] J.Halbritter, SRF09-TUPPO089 (Berlin, 2009),p.450 |
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