2011 Particle Accelerator Conference - List of Authors (Kim, J.S.)

Paper	Title	Page
WEP146	A Quasi-3D Model of Electron Cyclotron Resonance Ion Source (ECRIS)	1755
	L. Zhao, B. Cluggish, J.S. Kim Far-Tech, Inc., San Diego, California, USA
	Funding: Grant supported by DOE office of Nuclear Physics FAR-TECH, Inc is developing a hybrid, quasi-3D model to model charge breeding of an ion beam in an electron cyclotron resonance ion source. The model is a combination of 3D mapping of the plasma background calculated by GEM1D* and 3D tracking of the ion trajectories with MCBC*. The 3D electron distribution function and electric field of the background plasma are calculated self-consistently. The test beam ions are then tracked in it using MCBC which includes Coulomb, ionization and charge exchange collisions. The exact ion trajectories in the plasma and steady state 3D ion distribution at the extraction aperture are predicted and compared with previous simulations and experiments. D. H. Edgell et al., Rev. Sci. Instrum. 73, 641, 2002. ** J. S. Kim et al., Rev. Sci. Instrum. 79, 02B906, 2008.

Paper

Title

Page

A Quasi-3D Model of Electron Cyclotron Resonance Ion Source (ECRIS)

1755

L. Zhao, B. Cluggish, J.S. Kim
Far-Tech, Inc., San Diego, California, USA

Funding: Grant supported by DOE office of Nuclear Physics
FAR-TECH, Inc is developing a hybrid, quasi-3D model to model charge breeding of an ion beam in an electron cyclotron resonance ion source. The model is a combination of 3D mapping of the plasma background calculated by GEM1D* and 3D tracking of the ion trajectories with MCBC**. The 3D electron distribution function and electric field of the background plasma are calculated self-consistently. The test beam ions are then tracked in it using MCBC which includes Coulomb, ionization and charge exchange collisions. The exact ion trajectories in the plasma and steady state 3D ion distribution at the extraction aperture are predicted and compared with previous simulations and experiments.
* D. H. Edgell et al., Rev. Sci. Instrum. 73, 641, 2002.
** J. S. Kim et al., Rev. Sci. Instrum. 79, 02B906, 2008.