Author: Nantista, C.D.
Paper Title Page
WEPWI007 TTF3 Power Coupler Thermal Analysis for LCLS-II CW Operation 3503
 
  • L. Xiao, C. Adolphsen, Z. Li, C.D. Nantista, T.O. Raubenheimer
    SLAC, Menlo Park, California, USA
  • I.V. Gonin, N. Solyak
    Fermilab, Batavia, Illinois, USA
 
  The TESLA 9-cell SRF cavity design has been adopted for use in the LCLS-II SRF Linac. Its TTF3 coaxial Fundamental Power Coupler (FPC), developed for pulsed operation in the European XFEL and ILC, requires modest changes to make it suitable for LCLS-II CW operation, in which it must be able to handle up to 7 kW of average power with the maximum temperature rise not to exceed 150 C. In order to improve TTF3 FPC cooling, an increased copper plating thickness will be used on the inner and outer conductor stainless steel RF surfaces. Fully 3D FPC thermal analysis with copper plating was performed using the SLAC developed parallel finite element code suite ACE3P with integrated electromagnetic, thermal and mechanical multi-physics simulation capabilities. In this paper, we present TTF3 FPC thermal analysis simulation results obtained using ACE3P as well as a comparison with measurement results.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2015-WEPWI007  
Export • reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)