Author: Muehle, C.     [Mühle, C.]
Paper Title Page
THPF012 Status of the High Energy Beam Transport System for FAIR 3705
 
  • F. Hagenbuck, L.H.J. Bozyk, S. Damjanovic, A. Krämer, B. Merk, C. Mühle, S. Ratschow, B.R. Schlei, P.J. Spiller, B. Walasek-Höhne, H. Welker, C. Will
    GSI, Darmstadt, Germany
 
  The overall layout of the High Energy Beam Transport (HEBT) System of the Facility for Antiproton and Ion Research (FAIR)* did not change since its last presentation in 2008**. All necessitated adaptions as for example due to the introduction of the Modularized Start Version (MSV, module 0-3) of FAIR*** could be smoothly implemented. In the meanwhile the HEBT system is in its realisation phase with the procurement of its main components in progress. In the following adaptions of the system layout not yet covered in ** are summarized and an overview of the technical system design and procurement status are presented.
* FAIR Baseline Technical Report (FBTR), GSI 2006
** S. Ratschow et al., Proc. of EPAC08, THPP104, Genoa, Italy (2008)
***FAIR Green Paper - The Modularized Start Version, October 2009
 
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2015-THPF012  
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THPF015 Status of the FAIR Heavy Ion Synchrotron Project SIS100 3715
 
  • P.J. Spiller, U. Blell, L.H.J. Bozyk, J. Ceballos Velasco, T. Eisel, E.S. Fischer, O.K. Kester, H.G. König, H. Kollmus, V. Kornilov, P. Kowina, J.P. Meier, A. Mierau, C. Mühle, C. Omet, D. Ondreka, N. Pyka, H.R. Ramakers, P. Rottländer, C. Roux, P. Schnizer, St. Wilfert
    GSI, Darmstadt, Germany
 
  The procurements of major technical components for the heavy ion synchrotron SIS100 are progressing. Especially the production of the long lead items, the main superconducting dipole and quadrupole magnets and the main Rf systems could be started. The system layout for the injection system and the specifications for all injection devices has been completed. In parallel, the Digital Mock-Up (DMU) and design for major extraction components has been developed. Certain technical challenges observed during the acceptance tests of First of Series (FOS) components and risks and their mitigation will be presented.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2015-THPF015  
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