IPAC2015 - List of Authors (Damborsky, K.C.)

Paper	Title	Page
THPF133	Textured-Powder BI-2212 Ag Wire Technology Development	4030
	P.M. McIntyre, J.N. Kellams, J.M. Vandergrifft Texas A&M University, College Station, Texas, USA K.C. Damborsky Oxford Instruments, Semiconductor Systems, Carteret, New Jersey, USA L. Motowidlo SupraMagnetics, Inc., Plantsville, Connecticut, USA N. Pogue PSI, Villigen, Villigen, Switzerland
	Progress is reported in developing textured-powder Bi-2212 cores as a new approach to Bi-2212/Ag wire tech-nology. The process builds upon earlier work in which Bi-2212 fine powder can be highly textured in its a-b plane orientation and fabricated into square-cross-section bars. The current work concerns an Enhanced Textured Powder (ETP) process, in which silver nanopowder is homogeneously mixed with the Bi-2212 powder. We report studies of the effect of the addition on the phase dynamics near melt temperature. ETP cores are being prepared for compounding into a billet to fabricate multi-filament wire.
DOI •	reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2015-THPF133
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Paper

Title

Page

Textured-Powder BI-2212 Ag Wire Technology Development

4030

P.M. McIntyre, J.N. Kellams, J.M. Vandergrifft
Texas A&M University, College Station, Texas, USA
K.C. Damborsky
Oxford Instruments, Semiconductor Systems, Carteret, New Jersey, USA
L. Motowidlo
SupraMagnetics, Inc., Plantsville, Connecticut, USA
N. Pogue
PSI, Villigen, Villigen, Switzerland

Progress is reported in developing textured-powder Bi-2212 cores as a new approach to Bi-2212/Ag wire tech-nology. The process builds upon earlier work in which Bi-2212 fine powder can be highly textured in its a-b plane orientation and fabricated into square-cross-section bars. The current work concerns an Enhanced Textured Powder (ETP) process, in which silver nanopowder is homogeneously mixed with the Bi-2212 powder. We report studies of the effect of the addition on the phase dynamics near melt temperature. ETP cores are being prepared for compounding into a billet to fabricate multi-filament wire.

DOI •

reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2015-THPF133

Export •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)