Author: Lo, C.H.
Paper Title Page
WEPME019 Heat Distribution Analysis of Planar Baluns for 1kW Solid-state Amplifiers and Power Combining for 1.8kW 2294
 
  • T.-C. Yu, L.-H. Chang, M.H. Chang, L.J. Chen, F.-T. Chung, M.-C. Lin, Y.-H. Lin, Z.K. Liu, C.H. Lo, M.H. Tsai, Ch. Wang, T.-T. Yang, M.-S. Yeh
    NSRRC, Hsinchu, Taiwan
 
  Solid-state transmitter for booster and storage ring in synchrotron would be composed of hundreds of amplifier modules. The amplifier module is biased at class AB and constructed in push-pull operation. Recent trend of amplifier module design features higher power up to 800 Watts and equipped planar balun (balance-unbalance converter) for push-pull operation. In NSRRC, the exclusive round planar design has encounter high temperature situation at kW range. Therefore, further study on this thermal condition is carried out in this study. Four types of planar balun design and two laminate materials are used for heat analysis. The typical coaxial balun is also applied on actual amplifier design. The results bring the better design with proper laminate choice and leads to acceptable thermal distribution with 1kW output power at 500MHz. Besides, for a more compact module with higher output power, the combination of two chips on the same circuit reaching 1.8kW is also presented.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2014-WEPME019  
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