Author: Lee, K.H.
Paper Title Page
MOPPC096 Multiphysics Applications of ACE3P 361
 
  • K.H. Lee, C. Ko, Z. Li, C.-K. Ng, L. Xiao
    SLAC, Menlo Park, California, USA
  • G. Cheng, H. Wang
    JLAB, Newport News, Virginia, USA
 
  Funding: Work supported by US DOE Offices of HEP, ASCR and BES under contract AC02-76SF00515.
The TEM3P module of ACE3P, a parallel finite-element electromagnetic code suite from SLAC, focuses on the multiphysics simulation capabilities, including thermal and mechanical analysis for accelerator applications. In this pa- per, thermal analysis of coupler feedthroughs to supercon- ducting rf (SRF) cavities will be presented. For the realistic simulation, internal boundary condition is implemented to capture RF heating effects on the surface shared by a di- electric and a conductor. The multiphysics simulation with TEM3P matched the measurement within 0.4%.