Author: Heske, C.
Paper Title Page
MOPPP070 Characterization of Vacuum Chamber Samples for Superconducting Insertion Devices 723
  • D. Saez de Jauregui, T. Baumbach, S. Casalbuoni, S. Gerstl, A.W. Grau, M. Hagelstein, C. Heske, T. Holubek, B. Krause, A. Seiler, S. Stankov, L. Weinhardt
    Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
  • C.Z. Antoine, Y. Boudigou
    CEA/IRFU, Gif-sur-Yvette, France
  • C. Boffo
    BNG, Würzburg, Germany
  One of the key components of a superconducting insertion device is the ultra-high vacuum (UHV) chamber. In order to reach the accelerator UHV specifications, it is very important to control the surface chemical content and find proper cleaning procedures. To keep the geometric and resistive wall losses small, it is essential that the top few μm of the surface exhibits low roughness and good electrical conductivity at low temperatures. A 300-μm-thick 316L stainless steel foil, galvanized with a 30-μm copper layer, is used for the next superconducting undulator developed in a collaboration between KIT and BNG. We report here on different spectroscopic analyses as well as on residual resistivity ratio RRR measurements of the copper surface after cleaning procedures and annealing at various temperatures for different periods of time.