Title |
Quality Control of Copper Plating in STF-2 Input Power Couplers |
Authors |
- E. Kako, R. Ueki
KEK, Ibaraki, Japan
- K. Hiroaki, J. Taguchi
Nomura Plating Co, Ltd., Osaka, Japan
- K. Okihira, K. Sennyu
MHI, Hiroshima, Japan
- F. Saito, H. Umezawa
Tokyo Denkai Co., Ltd., Tokyo, Japan
- O. Yushiro
Toshiba Electron Tubes & Devices Co., Ltd, Tokyo, Japan
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Abstract |
Purity of thin copper plating using in input power couplers for superconducting cavities is one of important characteristics for considering thermal losses at low temperature. Various samples of thin copper plating on stainless sheets was fabricated by three companies with their own plating techniques. The RRR values of the samples with different thickness of copper plating were compared in the condition before and after heat treatment at 800oC in a brazing furnace. Deterioration of the RRR was observed in all of samples after heat treatment. The results of the RRR measurements and sample analysis of impurities will be reported in this paper.
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Paper |
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Conference |
SRF2017, Lanzhou, China |
Series |
International Conference on RF Superconductivity (18th) |
Proceedings |
Link to full SRF2017 Proccedings |
Session |
Poster Session |
Date |
17-Jul-17 14:00–17:00 |
Main Classification |
SRF Technology R&D |
Sub Classification |
Ancillaries |
Keywords |
ion, cavity, vacuum, cryomodule, controls |
Publisher |
JACoW, Geneva, Switzerland |
Editors |
Volker RW Schaa (GSI, Darmstadt, Germany); Yuan He (IMP, Lanzhou, China); Lu Li (IMP, Lanzhou, China); Ning Zhao (IHEP, Beijing, China) |
ISBN |
978-3-95450-191-5 |
Published |
January 2018 |
Copyright |
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