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https://doi.org/10.18429/JACoW-SRF2017-MOPB061
Title Quality Control of Copper Plating in STF-2 Input Power Couplers
Authors
  • E. Kako, R. Ueki
    KEK, Ibaraki, Japan
  • K. Hiroaki, J. Taguchi
    Nomura Plating Co, Ltd., Osaka, Japan
  • K. Okihira, K. Sennyu
    MHI, Hiroshima, Japan
  • F. Saito, H. Umezawa
    Tokyo Denkai Co., Ltd., Tokyo, Japan
  • O. Yushiro
    Toshiba Electron Tubes & Devices Co., Ltd, Tokyo, Japan
Abstract Purity of thin copper plating using in input power couplers for superconducting cavities is one of important characteristics for considering thermal losses at low temperature. Various samples of thin copper plating on stainless sheets was fabricated by three companies with their own plating techniques. The RRR values of the samples with different thickness of copper plating were compared in the condition before and after heat treatment at 800oC in a brazing furnace. Deterioration of the RRR was observed in all of samples after heat treatment. The results of the RRR measurements and sample analysis of impurities will be reported in this paper.
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Conference SRF2017, Lanzhou, China
Series International Conference on RF Superconductivity (18th)
Proceedings Link to full SRF2017 Proccedings
Session Poster Session
Date 17-Jul-17   14:00–17:00
Main Classification SRF Technology R&D
Sub Classification Ancillaries
Keywords ion, cavity, vacuum, cryomodule, controls
Publisher JACoW, Geneva, Switzerland
Editors Volker RW Schaa (GSI, Darmstadt, Germany); Yuan He (IMP, Lanzhou, China); Lu Li (IMP, Lanzhou, China); Ning Zhao (IHEP, Beijing, China)
ISBN 978-3-95450-191-5
Published January 2018
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