THYBB2
RadiaBeam, Santa Monica, California, USA
SLAC, Menlo Park, California, USA
NCSU, Raleigh, North Carolina, USA
| Paper | Title | Page |
|---|---|---|
THYBB2 |
Additive Manufacturing of Electrical and Thermal Devices: Challenges and Opportunities | |
|
||
| Metal-based, powder-bed additive manufacturing represents the convergence of three mature technologies: powder metallurgy, digital controls and high-power electron or laser beam optics. The aero, defense and medical industries have significantly benefited from this rapidly-evolving ecosystem, as it offers expanded design opportunities, part consolidation and reduced lead times. These applications are generally structural, utilizing titanium, aluminum, nickel or iron based alloys. Oxygen-free copper represents a significantly more challenging material because it’s intrinsic properties ( i.e. thermal conductivity) as well as the purity requirements of the final part. Furthermore, accelerator components are based on internal features, which complicated downstream processing. In this presentation, the general AM industry status will be reviewed, highlighting the successful use-cases from other industries. The challenges of printing in Cu will be described from a fundamentals perspective. Finally, the current status of Cu printing will be described, highlighting current progress and areas of future investigation. | ||
|
|
Slides THYBB2 [10.586 MB] | |
| Export • | reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml) | |