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https://doi.org/10.18429/JACoW-ICALEPCS2019-THAPP02
Title The Control System of the Elliptical Cavity and Cryomodule Test Stand Demonstrator for ESS
Authors
  • A. Gaget, T.J. Joannem
    CEA-DRF-IRFU, France
Abstract CEA IRFU Saclay* is taking part of ESS (European Spallation Source)** construction through several packages and, especially in the last three years on the Elliptical Cavity and Cryomodule Test stand Demonstrator (ECCTD)***. The project consists of RF test, conditioning, cryogenic cool-down and regulations of eight cryomodules with theirs four cavities each. For now, two medium beta cavities cryomodules have been successfully tested. This paper describes the context and the realization of the control system for cryogenic and RF processes, added to cavities tuning motorization relying on COTS solutions: Siemens PLC, EtherCAT Beckhoff modules, IOxOS fast acquisition cards and MRF timing cards.
Footnotes & References *IRFU, https://irfu.cea.fr/en/
**ESS, https://europeanspallationsource.se/
***ECCTD, http://irfu.cea.fr/dacm/en/Phocea/Viedeslabos/Ast/astvisu.php?idast=3359
Paper download THAPP02.PDF [1.744 MB / 6 pages]
Slides download THAPP02_TALK.PDF [6.841 MB]
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Conference ICALEPCS2019
Series International Conference on Accelerator and Large Experimental Physics Control Systems (17th)
Location New York, NY, USA
Date 05-11 October 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Karen S. White (ORNL, Oak Ridge, TN, USA); Kevin A. Brown (BNL, Upton, NY, USA); Philip S. Dyer (BNL, Upton, NY, USA); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-209-7
Online ISSN 2226-0358
Received 27 September 2019
Accepted 09 October 2019
Issue Date 30 August 2020
DOI doi:10.18429/JACoW-ICALEPCS2019-THAPP02
Pages 1538-1543
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.